FACH-PAK in the Programme Committee of Warsaw Pack 2018 trade fair
27.10.2017
We are pleased to announce that we have been honoured by the organisers of the Warsaw Pack International Fair of Packaging Technology and Packaging with an invitation to get involved in the Programme Committee. Tomasz Budrewicz, the President of the Company, received the invitation on behalf of the Company.
"Since the very beginning, I cheer for this event and so I accepted the invitation. Warsaw Pack success results from many factors. First of all it is the merit of organisers, who are young ambituous people who understand the needs of modern enterpreneours and their expectations towards fair trades," said Tomasz Budrewicz.
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